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INTEGRATED CIRCUITS
DATA SHEET
PCF21xxC family LCD drivers
Product specification Supersedes data of 1995 May 03 File under Integrated Circuits, IC12 1997 Mar 28
Philips Semiconductors
Product specification
LCD drivers
CONTENTS 1 2 3 4 5 6 6.1 6.2 6.3 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 8 9 10 11 12 13 13.1 13.1.1 13.1.2 13.2 13.2.1 13.2.2 13.2.3 14 15 FEATURES GENERAL DESCRIPTION QUICK REFERENCE DATA ORDERING INFORMATION BLOCK DIAGRAMS PINNING PCF2100C PCF2111C PCF2112C FUNCTIONAL DESCRIPTION PCF2100C PCF2111C PCF2112C Bus control logic Timing Input circuitry Expansion LIMITING VALUES HANDLING DC CHARACTERISTICS AC CHARACTERISTICS PACKAGE OUTLINES SOLDERING Plastic dual in-line packages By dip or wave Repairing soldered joints Plastic small outline packages By wave By solder paste reflow Repairing soldered joints (by hand-held soldering iron or pulse-heated solder tool) DEFINITIONS LIFE SUPPORT APPLICATIONS
PCF21xxC family
1997 Mar 28
2
Philips Semiconductors
Product specification
LCD drivers
1 FEATURES 2
PCF21xxC family
GENERAL DESCRIPTION
* Supply voltage 2.25 to 6.0 V * Low current consumption * Serial data input * CBUS control * One-point built-in oscillator * Stand-alone or expanded system * Power-on reset clear * LCD segments - 40 (PCF2100C) - 64 (PCF2111C) - 32 (PCF2112C) * Multiplex rate - 1 : 2 (PCF2100C) - 1 : 2 (PCF2111C) - 1 : 1 (PCF2112C) * Word length - 22 bits (PCF2100C) - 34 bits (PCF2111C) - 34 bits (PCF2112C). 3 QUICK REFERENCE DATA SYMBOL VDD IDD1 IDD2 PO Tamb Tstg 4 PARAMETER supply voltage supply current 1 supply current 2 power dissipation per output operating ambient temperature storage temperature
The PCF21xxC family are single-chip, silicon gate CMOS LCD driver circuits. A 3-line bus (CBUS) structure enables serial data transfer with microcontrollers. All inputs are CMOS/NMOS compatible. The devices have the same function and performance as those of the PCF21xx family, which they supersede. The maximum operating voltage required is reduced from 6.5 to 6.0 V.
CONDITIONS outputs open; CBUS inactive outputs open; CBUS inactive; Tamb = 25 C
MIN. 2.25 - - - -40 -65
TYP. - 20 20 - - -
MAX. 6.0 50 30 100 +85 +150
UNIT V A A mW C C
ORDERING INFORMATION TYPE NUMBER PACKAGE NAME DIP28 SO28 DIP40 VSO40 DIP40 VSO40 DESCRIPTION plastic dual in-line package; 28 leads (600 mil) plastic small outline package; 28 leads; body width 7.5 mm plastic dual in-line package; 40 leads (600 mil) plastic very small outline package; 40 leads plastic dual in-line package; 40 leads (600 mil) plastic very small outline package; 40 leads VERSION SOT117-1 SOT136-1 SOT129-1 SOT158-1 SOT129-1 SOT158-1
PCF2100CP PCF2100CT PCF2111CP PCF2111CT PCF2112CP PCF2112CT
1997 Mar 28
3
Philips Semiconductors
Product specification
LCD drivers
5 BLOCK DIAGRAMS
PCF21xxC family
handbook, full pagewidth
40-SEGMENT LCD BP1 26 BP2 25 S1 to S20 24 to 5 ANALOG VOLTAGE 2 DLEN CLB DATA 28 1 27 BUS CONTROL A LATCHES AND DRIVER CONTROL OSCILLATOR AND DIVIDER 3 VDD C O OSC R SHIFT REGISTER PCF2100C 4 V SS
MLD286
BACKPLANE AND SEGMENT DRIVERS
680 pF
B
O
1 M
Fig.1 Block diagram; PCF2100C.
handbook, full pagewidth
64-SEGMENT LCD BP1 38 BP2 37 S1 to S32 36 to 5 ANALOG VOLTAGE 2 DLEN CLB DATA 40 1 39 BUS CONTROL A LATCHES AND DRIVER CONTROL OSCILLATOR AND DIVIDER 3 VDD C O OSC R SHIFT REGISTER PCF2111C 4 V SS
MLD285
BACKPLANE AND SEGMENT DRIVERS
680 pF
B
O
1 M
Fig.2 Block diagram; PCF2111C.
1997 Mar 28
4
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
handbook, full pagewidth
32-SEGMENT LCD BP 38 S1 to S32 36 to 5 ANALOG VOLTAGE 2 DLEN CLB DATA 40 1 39 BUS CONTROL LATCHES AND DRIVER CONTROL OSCILLATOR AND DIVIDER 3 VDD C O OSC R SHIFT REGISTER PCF2112C 4 V SS
MLD287
BACKPLANE AND SEGMENT DRIVERS
1.5 nF
O
1 M
Fig.3 Block diagram; PCF2112C.
1997 Mar 28
5
Philips Semiconductors
Product specification
LCD drivers
6 6.1 PINNING PCF2100C PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 DESCRIPTION clock burst input (CBUS) supply voltage oscillator input supply voltage ground LCD driver output 20 LCD driver output 19 LCD driver output 18 LCD driver output 17 LCD driver output 16 LCD driver output 15 LCD driver output 14 LCD driver output 13 LCD driver output 12 LCD driver output 11 LCD driver output 10 LCD driver output 9 LCD driver output 8 LCD driver output 7 LCD driver output 6 LCD driver output 5 LCD driver output 4 LCD driver output 3 LCD driver output 2 LCD driver output 1 backplane driver output 2 backplane driver output 1 data input line (CBUS) data input line enable (CBUS)
S15 10 S14 11 S13 12 S12 13 S11 14
handbook, halfpage
PCF21xxC family
SYMBOL CLB VDD OSC VSS S20 S19 S18 S17 S16 S15 S14 S13 S12 S11 S10 S9 S8 S7 S6 S5 S4 S3 S2 S1 BP2 BP1 DATA DLEN
CLB 1 V DD 2 OSC 3 V SS 4 S20 5 S19 6 S18 7
28 DLEN 27 DATA 26 BP1 25 BP2 24 S1 23 S2 22 S3
PCF2100C
S17 8 S16 9 21 S4 20 S5 19 S6 18 S7 17 S8 16 S9 15 S10
MLD295
Fig.4 Pin configuration; SOT117-1 and SOT136-1.
1997 Mar 28
6
Philips Semiconductors
Product specification
LCD drivers
6.2 PCF2111C PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 DESCRIPTION clock burst input (CBUS) supply voltage oscillator input supply voltage ground LCD driver output 32 LCD driver output 31 LCD driver output 30 LCD driver output 29 LCD driver output 28 LCD driver output 27 LCD driver output 26 LCD driver output 25 LCD driver output 24 LCD driver output 23 LCD driver output 22 LCD driver output 21 LCD driver output 20 LCD driver output 19 LCD driver output 18 LCD driver output 17 LCD driver output 16 LCD driver output 15 LCD driver output 14 LCD driver output 13 LCD driver output 12 LCD driver output 11 LCD driver output 10 LCD driver output 9 LCD driver output 8 LCD driver output 7 LCD driver output 6 LCD driver output 5 LCD driver output 4 LCD driver output 3 LCD driver output 2 LCD driver output 1 backplane driver output 2 backplane driver output 1 data input line (CBUS) data input line enable (CBUS) 7
S22 15 S21 16 S20 17 S19 18 S18 19 S17 20 S29 S28 8 9
handbook, halfpage
PCF21xxC family
SYMBOL CLB VDD OSC VSS S32 S31 S30 S29 S28 S27 S26 S25 S24 S23 S22 S21 S20 S19 S18 S17 S16 S15 S14 S13 S12 S11 S10 S9 S8 S7 S6 S5 S4 S3 S2 S1 BP2 BP1 DATA DLEN 1997 Mar 28
CLB V DD OSC V SS S32
1 2 3 4 5
40 DLEN 39 DATA 38 BP1 37 BP2 36 S1 35 S2 34 S3 33 S4 32 S5 31 S6
S31 6 S30 7
S27 10
PCF2111C
S26 11 S25 12 S24 13 S23 14 30 S7 29 S8 28 S9 27 S10 26 S11 25 S12 24 S13 23 S14 22 S15 21 S16
MLD291
Fig.5 Pin configuration; SOT129-1 and SOT158-1.
Philips Semiconductors
Product specification
LCD drivers
6.3 PCF2112C PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 DESCRIPTION clock burst input (CBUS) supply voltage oscillator input supply voltage ground LCD driver output 32 LCD driver output 31 LCD driver output 30 LCD driver output 29 LCD driver output 28 LCD driver output 27 LCD driver output 26 LCD driver output 25 LCD driver output 24 LCD driver output 23 LCD driver output 22 LCD driver output 21 LCD driver output 20 LCD driver output 19 LCD driver output 18 LCD driver output 17 LCD driver output 16 LCD driver output 15 LCD driver output 14 LCD driver output 13 LCD driver output 12 LCD driver output 11 LCD driver output 10 LCD driver output 9 LCD driver output 8 LCD driver output 7 LCD driver output 6 LCD driver output 5 LCD driver output 4 LCD driver output 3 LCD driver output 2 LCD driver output 1 not connected backplane driver output data input line (CBUS) data input line enable (CBUS) 8
S22 15 S21 16 S20 17 S19 18 S18 19 S17 20 S29 S28 8 9
handbook, halfpage
PCF21xxC family
SYMBOL CLB VDD OSC VSS S32 S31 S30 S29 S28 S27 S26 S25 S24 S23 S22 S21 S20 S19 S18 S17 S16 S15 S14 S13 S12 S11 S10 S9 S8 S7 S6 S5 S4 S3 S2 S1 n.c. BP DATA DLEN 1997 Mar 28
CLB V DD OSC V SS S32
1 2 3 4 5
40 DLEN 39 DATA 38 BP 37 n.c. 36 S1 35 S2 34 S3 33 S4 32 S5 31 S6
S31 6 S30 7
S27 10
PCF2112C
S26 11 S25 12 S24 13 S23 14 30 S7 29 S8 28 S9 27 S10 26 S11 25 S12 24 S13 23 S14 22 S15 21 S16
MLD292
Fig.6 Pin configuration; SOT129-1 and SOT158-1.
Philips Semiconductors
Product specification
LCD drivers
7 FUNCTIONAL DESCRIPTION 7.3 PCF2112C
PCF21xxC family
An LCD segment or LED output is activated when the corresponding DATA bit is HIGH. 7.1 PCF2100C
When DATA bit 33 is HIGH, the latches are loaded. CLB pulse 35 transfers data from the shift register to the selected latches. 7.4 Bus control logic
When DATA bit 21 is HIGH, the A-latches (BP1) are loaded. With DATA bit 21 LOW, the B-latches (BP2) are loaded. CLB pulse 23 transfers data from the shift register to the selected latches. 7.2 PCF2111C
The following tests are carried out by the bus control logic: 1. Test on leading zero 2. Test on number of DATA bits 3. Test of disturbed DLEN and DATA signals during transmission. If one of the test conditions is not fulfilled, no action follows the load condition (load pulse with DLEN LOW) and the driver is ready to receive new data.
When DATA bit 33 is HIGH, the A-latches (BP1) are loaded. With DATA bit 33 LOW, the B-latches (BP2) are loaded. CLB pulse 35 transfers data from the shift register to the selected latches.
handbook, full pagewidth DLEN
CLB 1 2 3 4 5 6 7 8 32 20 33 21 34 22 35 23 load pulse PCF2111C and PCF2112C PCF2100C
test leading zero DATA bit number 0 output 1 S1 1 S1 leading zero 2 S2 2 S2 3 S3 3 S3 4 S4 4 S4 5 S5 5 S5 6 S6 6 S6 7 S7 7 S7 31 S31 19 S19 32 S32 20 S20
33 21 load bit
PCF2111C and PCF2112C PCF2100C
MLD296
Fig.7 CBUS data format.
1997 Mar 28
9
Philips Semiconductors
Product specification
LCD drivers
7.5 Timing
PCF21xxC family
OFF / OFF VDD 0.5 (VDD VSS VDD 0.5 (VDD VSS VDD VSS )
ON / OFF
OFF / ON
ON / ON BP1
VSS )
BP2
SX VSS VDD VSS 0.5 (VDD VSS ) 0 0.5 (VDD (VDD VSS ) VSS ) BP1 SX
VDD VSS 0.5 (VDD VSS ) 0 0.5 (VDD (VDD VSS ) VSS ) 1 f LCD BP2 SX
MLD294
Fig.8 Timing diagram for PCF2100C and PCF2111C.
handbook, halfpage
OFF
ON BP
VDD VSS VDD VSS VDD VSS 0 (VDD VSS ) 1 f LCD BP SX Segment X (SX)
MLD299
Fig.9 Timing diagram for PCF2112C.
1997 Mar 28
10
Philips Semiconductors
Product specification
LCD drivers
7.6 Input circuitry
PCF21xxC family
BUS handbook, halfpage DRIVER VDD2 R 100 k VSS VSS VDD
PCF21XXC
MLD284
VSS line is common. In systems where it is expected that VDD2 > VDD1 + 0.5 V, a resistor should be inserted to reduce the current flowing through the input protection. Maximum input current 40 A.
Fig.10 Input circuitry.
7.7
Expansion
handbook, full pagewidth
LCD
BP1
BP2
S1 to S32 VDD
BP1
BP2
S1 to S32
BP1
BP2
S1 to S32
DLEN CLB DATA MASTER DATA CLB DLEN1 DLEN2 DLEN3 PCF2111C OSC
DLEN CLB VSS DATA SLAVE1 PCF2111C OSC
DLEN CLB VSS DATA SLAVE1 PCF2111C OSC
VSS
MLD293
By connecting OSC to VSS the BP pins become inputs and generate signals synchronized to the single oscillator frequency, thus allowing expansion of several members of the PCF21xxC family up to the BP drive capability of the master. The PCF2112C can only function as a master for other PCF2112Cs.
Fig.11 Expansion possibility (using PCF2111C).
1997 Mar 28
11
Philips Semiconductors
Product specification
LCD drivers
8 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD VI VO IDD, ISS II IO Ptot PO Tstg Note 1. Derate by 7.7 mW/K when Tamb > 60 C. 9 HANDLING supply voltage input voltage DLEN, CLB, DATA and OSC output voltage BP1, BP2 and S1 to S32 supply current DC input current DC output current total power dissipation per package power dissipation per output storage temperature note 1 PARAMETER CONDITIONS
PCF21xxC family
MIN. -0.5
MAX. +8.0 V
UNIT
VSS - 0.5 VDD + 0.5 V VSS - 0.5 VDD + 0.5 V -50 -20 -25 - - -65 +50 +20 +25 500 100 +150 mA mA mA mW mW C
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices. See "Handling MOS devices". ESD in accordance with "MIL STD 883C, Method 3015".
1997 Mar 28
12
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
10 DC CHARACTERISTICS VDD = 2.25 to 6.0 V; VSS = 0 V; Tamb = -40 to +80 C; RO = 1 M; CO = 680 pF; unless otherwise specified. SYMBOL Supply VDD IDD supply voltage supply current note 1; see Fig.13 note 1; Tamb = 25 C; see Fig.13 VPOR VIL VIH ILI Ci Input OSC Iosc VBP ZO(BP) ZO(S) Notes 1. Outputs open; CBUS inactive. 2. Resets all logic, when VDD < VPOR. 3. Periodically sampled (not 100% tested). 4. Outputs measured one at a time. oscillator start-up current VI = VSS 0.5 - note 4; VDD = 5 V note 4; VDD = 5 V - - 1.2 20 0.5 1 5.0 - 5.0 7 A power-on reset voltage level note 2 Inputs CLB, DATA and DLEN LOW level input voltage HIGH level input voltage input leakage current input capacitance VI = VSS or VDD note 3 - 2.0 - - - - - - 0.8 - 1 10 V V A pF 2.25 - - - - 20 20 1.0 6.0 50 30 1.6 V A A V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
LCD outputs DC voltage of backplane drivers backplane driver output impedance segment driver output impedance mV k k
1997 Mar 28
13
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
11 AC CHARACTERISTICS VDD = 2.25 to 6.0 V; VSS = 0 V; Tamb = -40 to +80 C; RO = 1 M; CO = 680 pF; all timing values are referenced to VIH and VIL levels with an input voltage swing of VSS to VDD; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. - - - - - - - - - - - TYP. MAX. - - - - - - - - - 10 10 UNIT s s s s s s s s s s s
Inputs CLB, DATA and DLEN (see Fig.12) tSUDA tHDDA tSUEN tSUDI tSULD tBUSY tWH tWL tCLB tr tf fLCD data set-up time data hold time enable set-up time disable set-up time load pulse set-up time busy time CLB HIGH time CLB LOW time CLB cycle time rise time fall time 3 3 1 2 2.5 3 1 5 10 - -
LCD timing (see Figs. 12, 14, 15, 16 and 17) LCD frame frequency PCF2100C, PCF2111C PCF2112C tBS tPLCD transfer time with test loads driver delay time with test loads CO = 1.5 nF VDD = 5 V VDD = 5 V 60 30 - - 75 35 20 20 100 50 100 100 Hz Hz s s
1997 Mar 28
14
PCF21xxC family
Product specification
Fig.12 CBUS timing.
handbook, full pagewidth
1997 Mar 28
disable V IH min V IL max
enable
LCD drivers
V IH min
DLEN
Philips Semiconductors
V IL max
t CLB
V IH min 2 22 34 tf V IH min V IL max 23 (1) 35 (2)
V IH min
CLB
1 V IL max tr
V
IL max
tr
tf
DATA
t SUEN t SUDA t HDDA t SUDI t SULD
t
t HDDA
SUDA
t BUSY
t WL data S1 load bit
t WH
t WL load pulse t PCLD 0.5 V SX (V DD = 5 V) 0.5 V t BS VDD 2 0.5 V (V DD = 5 V) 0.5 V
leading zero
15
BP1, BP2 (except PCF 2112C) 0.5 V BP (PCF2112C) (V DD = 5 V) 0.5 V
MLD297
(1) Load pulse 23 for PCF2100C (see Fig.7). (2) Load pulse 35 for PCF2111C and PCF2112C (see Fig.7).
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
handbook, halfpage
20
MLD283
handbook, halfpage
(1) (2)
80
MLD282
f LCD (Hz)
I DD (A) 16
78
(1) (2) (3)
(3)
typ
typ 76
74 12 72
8 0 2 4 6
V DD (V)
70 8 0 2 4 6 VDD (V) 8
(1) Tamb = -40 c. (2) Tamb = +85 c. (3) Tamb = +25 c.
(1) Tamb = -40 c. (2) Tamb = +25 c. (3) Tamb = +85 c.
Fig.13 Supply current as a function of supply voltage.
Fig.14 Display frequency as a function of supply voltage; CO = 680 pF (except PCF2112C).
handbook, halfpage
37
MLD289
10 3 handbook, halfpage
MLD281
f
LCD (Hz) 36 typ
(1) (2) (1)
f
LCD (Hz)
(2)
typ
35
(3)
102
34
33 0 2 4 6V 8 DD (V)
10 10 1
1
C O (nF)
10
(1) Tamb = -40 c. (2) Tamb = +25 c. (3) Tamb = +85 c.
(1) RO = 1 M. (2) RO = 100 k.
Fig.15 Display frequency as a function of supply voltage; CO = 1.5 nF (only PCF2112C). 1997 Mar 28 16
Fig.16 Display frequency as a function of RO and CO; Tamb = 25 C; VDD = 5 V.
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
handbook, halfpage
2
MLD288
R O (k)
handbook, halfpage BP (PCF2112C), BP1, BP2
1.5 I L = 25 A
typ 1
(1) (2) (3)
S1 to S32 I L = 15 A
RS
0.5
(1) (2) R BP (3)
MLD298
0 0 2 4 6V 8 DD (V)
(1) Tamb = +85 c. (2) Tamb = +25 c. (3) Tamb = -40 c.
Fig.17 Test loads.
Fig.18 Output resistance of backplane and segments.
MLD290
handbook, halfpage
18
I OL (mA)
(1)
16 typ
(2)
14
(3)
12
10
8 0 2 4 6 VDD (V) 8
(1) Tamb = -40 c. (2) Tamb = +25 c. (3) Tamb = +85 c.
Fig.19 LOW level output current as a function of supply voltage (only PCF2112C).
1997 Mar 28
17
Philips Semiconductors
Product specification
LCD drivers
12 PACKAGE OUTLINES
handbook, plastic dual in-line package; 28 leads (600 mil) DIP28: full pagewidth
PCF21xxC family
SOT117-1
seating plane
D
ME
A2
A
L
A1 c Z e b1 b 28 15 MH wM (e 1)
pin 1 index E
1
14
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 5.1 0.20 A1 min. 0.51 0.020 A2 max. 4.0 0.16 b 1.7 1.3 0.066 0.051 b1 0.53 0.38 0.020 0.014 c 0.32 0.23 0.013 0.009 D (1) 36.0 35.0 1.41 1.34 E (1) 14.1 13.7 0.56 0.54 e 2.54 0.10 e1 15.24 0.60 L 3.9 3.4 0.15 0.13 ME 15.80 15.24 0.62 0.60 MH 17.15 15.90 0.68 0.63 w 0.25 0.01 Z (1) max. 1.7 0.067
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT117-1 REFERENCES IEC 051G05 JEDEC MO-015AH EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-14
1997 Mar 28
18
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
DIP40: plastic dual in-line package; 40 leads (600 mil)
SOT129-1
seating plane
D
ME
A2
A
L
A1 c Z e b1 b 40 21 MH wM (e 1)
pin 1 index E
1
20
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 4.0 0.16 b 1.70 1.14 0.067 0.045 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D
(1)
E
(1)
e 2.54 0.10
e1 15.24 0.60
L 3.60 3.05 0.14 0.12
ME 15.80 15.24 0.62 0.60
MH 17.42 15.90 0.69 0.63
w 0.254 0.01
Z (1) max. 2.25 0.089
52.50 51.50 2.067 2.028
14.1 13.7 0.56 0.54
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT129-1 REFERENCES IEC 051G08 JEDEC MO-015AJ EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-14
1997 Mar 28
19
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
SO28: plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
D
E
A X
c y HE vMA
Z 28 15
Q A2 A1 pin 1 index Lp L 1 e bp 14 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 18.1 17.7 0.71 0.69 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 0.42 0.39 L 1.4 0.055 Lp 1.1 0.4 0.043 0.016 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT136-1 REFERENCES IEC 075E06 JEDEC MS-013AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 91-08-13 95-01-24
1997 Mar 28
20
Philips Semiconductors
Product specification
LCD drivers
PCF21xxC family
VSO40: plastic very small outline package; 40 leads
SOT158-1
D
E
A X
c y HE vMA
Z 40 21
Q A2 A1 pin 1 index Lp L 1 e bp 20 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.70 0.11 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 bp 0.42 0.30 c 0.22 0.14 D (1) 15.6 15.2 E (2) 7.6 7.5 0.30 0.29 e 0.762 0.03 HE 12.3 11.8 0.48 0.46 L 2.25 Lp 1.7 1.5 Q 1.15 1.05 v 0.2 w 0.1 y 0.1 Z (1) 0.6 0.3
0.012 0.096 0.017 0.0087 0.61 0.010 0.004 0.089 0.012 0.0055 0.60
0.067 0.089 0.059
0.045 0.024 0.008 0.004 0.004 0.041 0.012
7 0o
o
Notes 1. Plastic or metal protrusions of 0.4 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT158-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-24
1997 Mar 28
21
Philips Semiconductors
Product specification
LCD drivers
13 SOLDERING 13.1 Introduction
PCF21xxC family
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. 13.3.2 WAVE SOLDERING
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). 13.2 13.2.1 DIP SOLDERING BY DIPPING OR BY WAVE
Wave soldering techniques can be used for all SO and VSO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 13.3.3 REPAIRING SOLDERED JOINTS
The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 13.2.2 REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. 13.3 13.3.1 SO and VSO REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO and VSO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1997 Mar 28
22
Philips Semiconductors
Product specification
LCD drivers
14 DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Short-form specification Limiting values
PCF21xxC family
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. The data in this specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 15 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1997 Mar 28
23
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
417067/1200/02/pp24
Date of release: 1997 Mar 28
Document order number:
9397 750 01649

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